Diagonal 6.23 mm (Type 1/2.9) Approx. 2.19M-Effective Pixel Color CMOS Image Sensor
Full HD Support High Sensitivity CMOS Image Sensor with a Super Small Package for Industrial Applications
Sony has commercialized the "IMX323LQN" CMOS Image Sensor that realizes a compact and thin package while maintaining low illumination performance equal to that of the existing Sony product (IMX222LQJ*) that improved sensitivity in the near infrared region for industrial applications. WLCSP (Wafer Level Chip Size Package) technology is used to realize a smaller size while maintaining performance such as visibility. The package size has been reduced to 1/8 the volume of the previous product, which helps to greatly reduce the set size.
* See the New Product Information released in August 2013
- Frame rate 30 frame/s
- On-chip 10-bit/12-bit ADC
- Pixel size: 2.8 µm-square unit pixel
- Compact and thin package using WLCSP technology 7.55mm (H) × 5.75mm (V) × 0.77mm (t)
- Improved sensitivity in the near infrared range
* Exmor is a trademark of Sony Corporation. The Exmor is a version of Sony's high performance CMOS image sensor with high-speed processing, low noise and low power dissipation by using column-parallel A/D conversion.
Compact and thin package
The IMX323LQN is the first Sony CMOS image sensor for industrial applications to use WLCSP (Wafer Level Chip Size Package) technology, which realized a reduced package size and thickness (7.55mm (H) × 5.75mm (V) × 0.77mm (t)) compared to the existing product IMX222LQJ (12.8mm (H) × 10.8mm (V) × 1.95mm (t)). This makes it possible to shrink the set board size, which helps to reduce the camera size (Photograph 1).
Improved sensitivity in the near infrared range
Improved picture quality at low illumination is strongly demanded of cameras for industrial applications. To meet this demand, Sony also applied technology to the IMX323LQN that increases sensitivity in the near infrared range as well as the visible light range. This makes it possible to obtain clear images that enable to sufficiently discriminate subjects even under moonlit conditions. (Photograph 2).
*If the mouse cursor changes over the photo, you can click to see the larger version in a new window.
Photograph 1 Comparison of existing product and IMX323LQN packages
Existing product IMX222LQJ New product IMX323LQN
Photograph 2 Image sample
Conditions: 0.1 lx, F1.4 (ADC 12 bit mode, 30 frame/s)
Existing product IMX222LQJ Gain 42 dB
New product IMX323LQN Gain 45 dB
Table 1 Device Structure
||Existing product IMX222LQJ
||New product IMX323LQN
||Diagonal 6.4 mm
|Diagonal 6.23 mm
|Number of effective pixels
||1984 (H) × 1225 (V)
Approx. 2.43M pixels
|1985 (H) × 1105 (V)
Approx. 2.19M pixels
|Unit cell size
||2.8 µm (H) × 2.8 µm (V)
||2.7 V / 1.8 V / 1.2 V
||94 pin LGA
||80 pin CSP BGA
||0 to 42 dB (0.3 dB Step)
||0 to 45 dB (0.3 dB Step)
Table 2 Image Sensor Characteristics
Table 3 Basic drive mode
||Recommended number of recording pixels
||1920 (H) × 1080 (V)
Approx. 2.07M pixels
||1280 (H) × 720 (V)
Approx. 9.2M pixels
*Sony reserves the right to change products and specifications without prior notice.
The IMX323LQN was commercialized to add the additional values of "compact and thin" to "high speed, high definition and high sensitivity" Sony CMOS image sensors. We feel proud that these added values are the result of all product team members working together to develop this device. Please consider Sony's continuously evolving Full HD compatible CMOS image sensors for industrial applications.
Designers (from the left)
Mr. Arai Ms. Suzuki Mr. Tateishi
Mr. Fukumoto Mr. Igarashi Mr. Oohata Mr. Murai